Senior Engineer, Process Integration, NAND, NTI

As a Senior/Principal NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability

• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability

• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners

• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility

• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams

• Assist in the transfer of new technology from R&D to manufacturing

• Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing

• Artificial Intelligence Using, applying and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision making across projects and teams.

Successful candidates for this position, Must have:

• Passion in semiconductor technology and innovation

• Adept at data analysis, problem-solving, and process integration optimization

• Excellent communication skills and ability to work in cross-functional teams

• Committed to quality, collaboration, and continuous improvement

• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment

• Ability to travel for extended periods to the US for collaborative R&D work

Requirements:

• BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field

• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc.

• Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement

• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms

• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable

• Exposure to R&D (such as HKMG) and transfer/manufacturing is desirable